New high-performance insulators for smaller computer chips

The increasing performance of computer chips requires smaller and smaller components to make them work faster. To achieve this, new high-performance insulators are required to make them work. The goal of this project was to develop a manufacturing process for a dielectric insulator capable of supporting the next generations of computers.

What scientific or technical barriers did you have to overcome?

The material developed (SrHfTiO3) had never been prepared as an ultra-thin film. This is required to integrate it with modern computer chip manufacturing processes. We developed a process based upon Atomic Layer Deposition (ALD) which is being used in state-of-the-art processor and memory chips.

Who took part in the project?

The project was a joint collaboration between Professor Matt Rosseinsky (Dept. Chemistry) and Professor Paul Chalker (School of Engineering). The project employed Dr Kate Black to develop the manufacturing process, which involved finding the deposition conditions for the thin film and characterising its properties to ensure they were appropriate.

What were the key steps in achieving the vision / mission?

They steps in the project were to identify suitable precursors for the SrHfTiO3 and the appropriate conditions required to deposit the thin film.

How far has the project progressed?

The project has established a manufacturing process for SrHfTiO3. The next stage is to industrialise the process with a chip manufacturer. We are currently working with industry at various levels of the supply chain to get this material adopted in future devices. The Liverpool team has a track record in doing this before and hopes that the new material will be as successful.

What concrete outcomes are there so far?

The project has resulted in new patent applications to protect the composition of the thin film material and the details of the manufacturing process.

What could be the future developments / benefits?

We certainly hope that the new dielectric material will be adopted in the new generations of computers over the next few years.